Performance Evaluation of Liquid 3D Chip Cooling Systems under Non-uniform Power Density: Effects of Inlet and Plenum Configurations Conference

(2019). Performance Evaluation of Liquid 3D Chip Cooling Systems under Non-uniform Power Density: Effects of Inlet and Plenum Configurations . -1265.

authors

date/time interval

  • May 28, 2019 -

publication date

  • January 1, 2019

keywords

  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology
  • thermal management

end page

  • 1265