Performance Evaluation of Liquid 3D Chip Cooling Systems under Non-uniform Power Density: Effects of Inlet and Plenum Configurations Conference

Soleimanikutanaei, Soheil, Lin, Cheng-Xian, Pala, Nezih et al. (2019). Performance Evaluation of Liquid 3D Chip Cooling Systems under Non-uniform Power Density: Effects of Inlet and Plenum Configurations . 1260-1265.

cited authors

  • Soleimanikutanaei, Soheil; Lin, Cheng-Xian; Pala, Nezih; Quan, Gang

authors

date/time interval

  • May 28, 2019 -

publication date

  • January 1, 2019

webpage

keywords

  • 3D chips
  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology
  • inlet and outlet plenums
  • liquid cooling
  • thermal management

Location

  • Las Vegas, NV

Conference

  • 18th IEEE InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

publisher

  • IEEE

start page

  • 1260

end page

  • 1265