Journal of Microelectronics and Electronic Packaging

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Journal of Microelectronics and Electronic Packaging Journal

publication venue for

3D integrated high-precision passives on thin glass substrates for miniaturized and high-performance RF components. 15:107-116. 2018
Electrodeposited copper-graphite composites for low-CTE-Integrated thermal structures 2017
Additive manufacturing design and fabrication of ceramic cylindrical ion trap mass analyzer chips for miniaturized mass spectrometer smart-device (internet of things) applications 2016

International Standard Serial Number (ISSN)

1551-4897