Additive manufacturing design and fabrication of ceramic cylindrical ion trap mass analyzer chips for miniaturized mass spectrometer smart-device (internet of things) applications Conference

Roman, P, Chen, X, Jones, WK et al. (2016). Additive manufacturing design and fabrication of ceramic cylindrical ion trap mass analyzer chips for miniaturized mass spectrometer smart-device (internet of things) applications . 13(3), 113-120. 10.4071/imaps.517

cited authors

  • Roman, P; Chen, X; Jones, WK; Karbasi, A; Newton, CM; Bates, T; Denkins, J; Bhansali, S

abstract

  • The current computing power and network capabilities of handheld smart devices is helping to drive the development of new sensors, enabling the Internet of things. A chip-based mass spectrometer technology promises to offer a smart-device autonomous microsystem chemical analysis capability for sample determination and process monitoring for multiple applications in a small low-power instrument package. This project focuses on the development of cylindrical ion trap (CIT) mass analyzer chips fabricated using three-dimensional (3-D) additive manufacturing (AM) and planar low temperature cofired ceramic thick film processes for a chipbased mass spectrometer microsystem. The CIT is a mass analyzer composed of planar electrodes and operates by trapping and ejecting sample ions based on their mass in a radiofrequency field. Because of its simplicity, CITs may be easily miniaturized and connected in tandem to achieve multiplexing. AM materials and methods enable enhanced trap miniaturization through micromachining and electrode patterning methods, fast and cost-effective prototyping, batch fabrication, and material formulation flexibility. The current design incorporates three parallel ceramic plate metalized electrodes making up a singular trap geometry in a 10-mm2 ceramic chip, forming a mass analyzer of reduced size, mass, and power, with enhanced material robustness for extended range use and in harsh environments. Unique processes have been developed to produce these devices which include conformal metallization layers, adhesion layers, ceramic paste formulations, sacrificial supporting materials, and cofiring methods. Additionally, 3-D printing brings a unique design and fabrication capability enabling novel structures, material blending, and heterogeneous integration. With true digital control, the designs are easily scalable and shape agnostic.

publication date

  • July 1, 2016

Digital Object Identifier (DOI)

start page

  • 113

end page

  • 120

volume

  • 13

issue

  • 3