Additively-Deposited Fan-Out Interconnects for Power/RF Co-Packaging with Glass-Laminate Hybrid Panels
Conference
Rathnayaka, S, Rodriguez, G, van Olmen, R et al. (2026). Additively-Deposited Fan-Out Interconnects for Power/RF Co-Packaging with Glass-Laminate Hybrid Panels
. Proceedings - Electronic Components and Technology Conference, 2578-2582. 10.1109/ECTC51846.2026.00425
Rathnayaka, S, Rodriguez, G, van Olmen, R et al. (2026). Additively-Deposited Fan-Out Interconnects for Power/RF Co-Packaging with Glass-Laminate Hybrid Panels
. Proceedings - Electronic Components and Technology Conference, 2578-2582. 10.1109/ECTC51846.2026.00425
Fan-out packaging offers compelling advantages for RF and power system integration, including reduced interconnect parasitics, improved electrical performance, and direct board-level assembly without an intermediate package. However, existing fan-out approaches do not allow seamless integration of multiple substrate technologies. In addition, they utilize semi-additively patterned copper interconnects with several process steps and constraints. In this work, we present the first demonstration of an additively deposited fan-out interconnect platform implemented on hybrid glass-laminate panels for co-packaging power, RF, and data-converter components. The proposed architecture employs cavity-embedded inorganic tiles within large-area laminate substrates, enabling micron-level die placement accuracy and compatibility with panel-scale manufacturing. Glass-laminate hybrid panels enable handling and scaling of glass tiles with the tooling and infrastructure of standard laminate manufacturing. Additive fan-out interconnects based on fine-line screen printing of silver nanoflake inks eliminate the complexity of semi-additive copper plating while achieving ultra-thin traces (50 μm) with sheet resistances below 30 mΩ/sq. Robust, low-parasitic and highly-reliable silver interconnections are fabricated through carefully-optimized, high-quality screen-printing processes. The process is validated using a high-efficiency DC-DC converter and a wideband RF power amplifier, both demonstrating performances comparable to simulations and standard SMD implementations while providing the advantages in miniaturization and system performance. These results establish a scalable and manufacturable pathway for next-generation RF-power co-integration using hybrid panel fan-out packaging.
