New On-Chip Nanomechanical Testing Laboratory - Applications to Aluminum and Polysilicon Thin Films Article

Gravier, Sebastien, Coulombier, Michael, Safi, Asmahan et al. (2009). New On-Chip Nanomechanical Testing Laboratory - Applications to Aluminum and Polysilicon Thin Films . JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 18(3), 555-569. 10.1109/JMEMS.2009.2020380

International Collaboration

cited authors

  • Gravier, Sebastien; Coulombier, Michael; Safi, Asmahan; Andre, Nicolas; Boe, Alexandre; Raskin, Jean-Pierre; Pardoen, Thomas

authors

publication date

  • June 1, 2009

published in

keywords

  • COUPLED GRAIN-GROWTH
  • DEFORMATION
  • Engineering
  • Engineering, Electrical & Electronic
  • FRACTURE STRENGTH
  • Instruments & Instrumentation
  • MECHANICAL-PROPERTIES
  • MEMS MATERIALS
  • MEMS test structures
  • Mechanical properties
  • NANOINDENTATION
  • Nanoscience & Nanotechnology
  • PART I
  • Physical Sciences
  • Physics
  • Physics, Applied
  • SILICON
  • STRESS
  • Science & Technology
  • Science & Technology - Other Topics
  • TENSILE
  • Technology
  • microelectromechanical systems (MEMS)
  • nanomechanical testing
  • release
  • size effect
  • thin materials

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 555

end page

  • 569

volume

  • 18

issue

  • 3