Element level digital phased arrays (DPAs) are widely considered the future of a growing number of practical applications. In fact, according to many RF system experts, they have been the future for more than 30 years; but until recently, the packaging and thermal efficiency of electronics has made their adoption slow for SWaP constrained applications. Increases in density, performance and efficiency of microelectronics are creating a paradigm shift in future DoD RF systems toward DPAs. DPAs are known for the multifunction provided by a software-defined array payload. Each element can be used as an RF pixel that can be digitally addressed in any combination to form transmit and receive beams for arbitrary functions. DPA's software defined payloads enable low SWaP platforms to have the unique capabilities to 1) enable multiple RF functions for the same SWaP and 2) reduce lifecycle cost through standardized and scalable architectures. In this paper, we present a number of recent efforts at BAE Systems to bring these considerations into a present reality for the DoD.
