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Managing Thermal Transients with Passive Phase-Change Cooling Inside Copper Leadframe Packages
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Managing Thermal Transients with Passive Phase-Change Cooling Inside Copper Leadframe Packages .
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Managing Thermal Transients with Passive Phase-Change Cooling Inside Copper Leadframe Packages .
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Overview
Affiliation
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Overview
date/time interval
January 1, 2025 - December 31, 2025
awarded by
Semiconductor Research Corporation
sponsor award ID
2025-PK-3314
Affiliation
contributor
Pulugurtha, Markondeyaraj
Principal Investigator
Sarwat, Arif
Co-Principal Investigator
