2023 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS/MOEMS, DTIP

Edit Your Profile

2023 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS/MOEMS, DTIP Journal

publication venue for

Effect of Silicon Substrate Resistivity on Large-Area High-Voltage Spiral Inductor Performance 2023

International Standard Serial Number (ISSN)

2836-8487