Florida International University
Edit Your Profile
FIU Discovery
Toggle navigation
Browse
Home
People
Organizations
Scholarly & Creative Works
Research Facilities
Support
International Journal of Microcircuits and Electronic Packaging
Journal
Overview
Identifiers
View All
Overview
publication venue for
Substrate embedded heat pipes compatible with ceramic cofired processing
. 21:52-58.
1998
MODELING OF THICK-FILM STRIPLINES USING THE FINITE ELEMENT METHOD.
1982
Identifiers
International Standard Serial Number (ISSN)
1063-1674