INVERSE DESIGN OF COOLING OF ELECTRONIC CHIPS SUBJECT TO SPECIFIED HOT SPOT TEMPERATURE AND COOLANT INLET TEMPERATURE Conference

Reddy, Sohail R, Dulikravich, George S. (2015). INVERSE DESIGN OF COOLING OF ELECTRONIC CHIPS SUBJECT TO SPECIFIED HOT SPOT TEMPERATURE AND COOLANT INLET TEMPERATURE .

cited authors

  • Reddy, Sohail R; Dulikravich, George S

sustainable development goals

date/time interval

  • July 6, 2015 -

publication date

  • January 1, 2015

keywords

  • Engineering
  • Engineering, Mechanical
  • Physical Sciences
  • Science & Technology
  • Technology
  • Thermodynamics

Location

  • San Francisco, CA

International Standard Book Number (ISBN) 13

Conference

  • ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)

publisher

  • AMER SOC MECHANICAL ENGINEERS