Meniscus-confined electrochemical additive manufacturing of copper microstructures: Design, fabrication, characterization, and decorative art technology Article

Siddiqui, Hafsa, Singh, Netrapal, Rao, Koyalada Bhavani Srinivas et al. (2023). Meniscus-confined electrochemical additive manufacturing of copper microstructures: Design, fabrication, characterization, and decorative art technology . MATERIALS TODAY COMMUNICATIONS, 35 10.1016/j.mtcomm.2023.105796

cited authors

  • Siddiqui, Hafsa; Singh, Netrapal; Rao, Koyalada Bhavani Srinivas; Kumar, Satendra; Chauhan, Viplov; Goswami, Manoj; Ashiq, Mohammad; Sathish, N; Kumar, Surender

authors

publication date

  • June 1, 2023

published in

keywords

  • CORROSION
  • CU-ZN ALLOYS
  • Characterization
  • Design
  • ELECTRODEPOSITION
  • Electrochemical additive manufacturing
  • Fabrication
  • Materials Science
  • Materials Science, Multidisciplinary
  • Metal artwork
  • Microstructures
  • Science & Technology
  • Technology
  • ZINC

Digital Object Identifier (DOI)

publisher

  • ELSEVIER

volume

  • 35