The Case for Hybrid Photonic Plasmonic Interconnects (HyPPIs): Low-Latency Energy-and-Area-Efficient On-Chip Interconnects Article

Sun, Shuai, Badawy, Abdel-Hameed A, Narayana, V et al. (2015). The Case for Hybrid Photonic Plasmonic Interconnects (HyPPIs): Low-Latency Energy-and-Area-Efficient On-Chip Interconnects . IEEE Photonics Journal, 7(6), 10.1109/JPHOT.2015.2496357

Open Access

cited authors

  • Sun, Shuai; Badawy, Abdel-Hameed A; Narayana, V; El-Ghazawi, Tarek; Sorger, Volker J

authors

publication date

  • December 1, 2015

published in

keywords

  • BANDWIDTH
  • COMMUNICATION
  • COMPACT
  • Engineering
  • Engineering, Electrical & Electronic
  • GERMANIUM PHOTODETECTOR
  • GRAPHENE PHOTODETECTOR
  • HIGH-SPEED
  • MODULATOR
  • Optical interconnect
  • Optics
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Science & Technology
  • Technology
  • WAVE-GUIDE
  • bit flow density
  • extrinsic modulation
  • hybrid photonic-plasmonic interconnect (HyPPI)
  • hybridization
  • intrinsic modulation
  • on-chip structure
  • plasmonics

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

volume

  • 7

issue

  • 6