On the Thermal Vulnerability of 3D-Stacked High-Bandwidth Memory Architectures Conference

Elahi, Mehdi, Elshmay, Mohamed R, Badawy, Abdel-Hameed et al. (2025). On the Thermal Vulnerability of 3D-Stacked High-Bandwidth Memory Architectures . 162-164. 10.1145/3767110.3767140

Open Access

cited authors

  • Elahi, Mehdi; Elshmay, Mohamed R; Badawy, Abdel-Hameed; Patooghy, Ahmad

authors

date/time interval

  • October 7, 2025 -

publication date

  • January 1, 2025

keywords

  • 3D-Stacked Memory
  • Computer Science
  • Computer Science, Hardware & Architecture
  • Computer Science, Theory & Methods
  • HBM
  • Science & Technology
  • Security
  • Technology
  • Thermal Attack
  • Thermal Coupling

Location

  • WA

Digital Object Identifier (DOI)

Conference

  • 2025 International Symposium on Memory Systems-MEMSYS

publisher

  • ASSOC COMPUTING MACHINERY

start page

  • 162

end page

  • 164