Etch the borosilicate glass to form a straight through-glass-via based on the FLACE technology Article

Xu, Qianfeng, Fang, Dan, Zhang, Xiaodong et al. (2022). Etch the borosilicate glass to form a straight through-glass-via based on the FLACE technology . JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 32(5), 10.1088/1361-6439/ac628e

cited authors

  • Xu, Qianfeng; Fang, Dan; Zhang, Xiaodong; Chen, Yu; Wang, Xiaohua; Cai, Yong; Zhang, Baoshun; Wei, Zhipeng

authors

publication date

  • May 1, 2022

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • FUSED-SILICA
  • HIGH-DENSITY
  • INTERPOSERS
  • Instruments & Instrumentation
  • MICROFLUIDIC CHANNEL
  • Nanoscience & Nanotechnology
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Science & Technology
  • Science & Technology - Other Topics
  • TGV
  • Technology
  • etch
  • femtoseconds laser
  • taper

Digital Object Identifier (DOI)

publisher

  • IOP Publishing Ltd

volume

  • 32

issue

  • 5