Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB Conference

Stoukatch, Serguei, Andre, Nicolas, Delhaye, Thibault et al. (2020). Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB .

cited authors

  • Stoukatch, Serguei; Andre, Nicolas; Delhaye, Thibault; Dupont, Francois; Redoute, Jean-Michel; Flandre, Denis

authors

date/time interval

  • October 25, 2020 -

publication date

  • January 1, 2020

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • PERFORMANCE
  • Remote Sensing
  • Science & Technology
  • Technology
  • anisotropic conductive films
  • assembly methods for prototypes
  • low-cost flip-chip assembly
  • sensors assembly on flex

Location

  • ELECTR NETWORK

Conference

  • IEEE Sensors Conference

publisher

  • IEEE