Through-Wafer Optical Interconnects For Multi-Wafer Wafer-Scale Integrated Architectures Conference

Hornak, LA, Tewksbury, SK, Hatamian, M et al. (1986). Through-Wafer Optical Interconnects For Multi-Wafer Wafer-Scale Integrated Architectures . SMART BIOMEDICAL AND PHYSIOLOGICAL SENSOR TECHNOLOGY XI, 0679 57-62. 10.1117/12.939568

cited authors

  • Hornak, LA; Tewksbury, SK; Hatamian, M; Ligtenberg, A; Sugla, B; Franzon, P

authors

publication date

  • December 19, 1986

published in

keywords

  • 40 Engineering
  • 4006 Communications Engineering
  • 4009 Electronics, Sensors and Digital Hardware
  • 51 Physical Sciences
  • 5102 Atomic, Molecular and Optical Physics

Digital Object Identifier (DOI)

Conference

  • Current Developments in Optical Engineering and Diffraction Phenomena

publisher

  • SPIE, the international society for optics and photonics

start page

  • 57

end page

  • 62

volume

  • 0679