Thermal Aware Lifetime Reliability Optimization for Automotive Distributed Computing Applications Conference

Bankar, Ajinkya S, Sha, Shi, Chaturvedi, Vivek et al. (2020). Thermal Aware Lifetime Reliability Optimization for Automotive Distributed Computing Applications . 498-505. 10.1109/ICCD50377.2020.00090

International Collaboration

cited authors

  • Bankar, Ajinkya S; Sha, Shi; Chaturvedi, Vivek; Quan, Gang

authors

date/time interval

  • October 18, 2020 -

publication date

  • January 1, 2020

keywords

  • Automotive reliability
  • Computer Science
  • Computer Science, Hardware & Architecture
  • ECU
  • Engineering
  • Engineering, Electrical & Electronic
  • FEASIBILITY ANALYSIS
  • ISO 26262
  • MANAGEMENT
  • Science & Technology
  • Technology
  • Thermal Aware
  • system-level MTTF

Location

  • ELECTR NETWORK

Digital Object Identifier (DOI)

Conference

  • 38th IEEE International Conference on Computer Design (ICCD)

publisher

  • IEEE COMPUTER SOC

start page

  • 498

end page

  • 505