A Novel Low Loss 3D System-in-Package Approach for 60GHz Antenna on Chip Applications Conference

Adamshick, Stephen, Govindarajulu, Sandhiya Reddy, Alwan, Elias A. (2020). A Novel Low Loss 3D System-in-Package Approach for 60GHz Antenna on Chip Applications . 537-540. 10.1109/mwscas48704.2020.9184617

cited authors

  • Adamshick, Stephen; Govindarajulu, Sandhiya Reddy; Alwan, Elias A

authors

date/time interval

  • April 9, 2020 -

publication date

  • January 1, 2020

keywords

  • Antenna arrays
  • Computer Science
  • Computer Science, Theory & Methods
  • Electronics packaging
  • Engineering
  • Engineering, Electrical & Electronic
  • Microstrip patch antennas
  • Millimeter-wave communication
  • ON-CHIP
  • Science & Technology
  • System integration
  • Technology

Location

  • ELECTR NETWORK

Digital Object Identifier (DOI)

Conference

  • 63rd IEEE International Midwest Symposium on Circuits and Systems (MWSCAS)

publisher

  • IEEE

start page

  • 537

end page

  • 540