Full-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failure Article

Wang, ZD, Jensen, BD, Chow, LLW et al. (2006). Full-wave electromagnetic and thermal modeling for the prediction of heat-dissipation-induced RF-MEMS switch failure . JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 16(1), 157-164. 10.1088/0960-1317/16/1/021

Open Access

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Instruments & Instrumentation
  • MICROSWITCHES
  • Nanoscience & Nanotechnology
  • Physical Sciences
  • Physics
  • Physics, Applied
  • SCATTERING
  • Science & Technology
  • Science & Technology - Other Topics
  • Technology

Digital Object Identifier (DOI)

publisher

  • IOP PUBLISHING LTD

start page

  • 157

end page

  • 164

volume

  • 16

issue

  • 1