Thermal stability analysis of thin film Ni-NiOx-Cr tunnel junctions Article

Krishnan, S, Emirov, Y, Bhansali, S et al. (2010). Thermal stability analysis of thin film Ni-NiOx-Cr tunnel junctions . THIN SOLID FILMS, 518(12), 3367-3372. 10.1016/j.tsf.2009.10.021

cited authors

  • Krishnan, S; Emirov, Y; Bhansali, S; Stefanakos, E; Goswami, Y

sustainable development goals

publication date

  • April 2, 2010

published in

keywords

  • ANTENNA
  • Annealing
  • CURRENT-VOLTAGE CHARACTERISTICS
  • Current-voltage
  • DC
  • DIODE
  • Materials Science
  • Materials Science, Coatings & Films
  • Materials Science, Multidisciplinary
  • Metal-Insulator-Metal tunnel junction
  • Nickel oxide
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Physics, Condensed Matter
  • Science & Technology
  • THZ
  • Technology
  • Transmission Electron Microscopy
  • X-ray Diffraction

Digital Object Identifier (DOI)

publisher

  • ELSEVIER SCIENCE SA

start page

  • 3367

end page

  • 3372

volume

  • 518

issue

  • 12