A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems Article

Oh, KW, Han, A, Bhansali, S et al. (2002). A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems . JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 12(2), 187-191. 10.1088/0960-1317/12/2/313

Industry Collaboration International Collaboration

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Instruments & Instrumentation
  • Nanoscience & Nanotechnology
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Science & Technology
  • Science & Technology - Other Topics
  • Technology

Digital Object Identifier (DOI)

publisher

  • IOP PUBLISHING LTD

start page

  • 187

end page

  • 191

volume

  • 12

issue

  • 2