A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems Article

Oh, KW, Han, A, Bhansali, S et al. (2002). A low-temperature bonding technique using spin-on fluorocarbon polymers to assemble microsystems . Journal of Micromechanics and Microengineering, 12(2), 187-191. 10.1088/0960-1317/12/2/313

Industry Collaboration International Collaboration

cited authors

  • Oh, KW; Han, A; Bhansali, S; Ahn, CH

sustainable development goals

authors

publication date

  • March 1, 2002

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Instruments & Instrumentation
  • Nanoscience & Nanotechnology
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Science & Technology
  • Science & Technology - Other Topics
  • Technology

Digital Object Identifier (DOI)

start page

  • 187

end page

  • 191

volume

  • 12

issue

  • 2