SELECTIVE ELECTROLESS COPPER PLATING ON SILICON SEEDED BY COPPER-ION IMPLANTATION Article

BHANSALI, S, SOOD, DK, ZMOOD, RB. (1994). SELECTIVE ELECTROLESS COPPER PLATING ON SILICON SEEDED BY COPPER-ION IMPLANTATION . THIN SOLID FILMS, 253(1-2), 391-394. 10.1016/0040-6090(94)90354-9

keywords

  • COPPER
  • ION IMPLANTATION
  • Materials Science
  • Materials Science, Coatings & Films
  • Materials Science, Multidisciplinary
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Physics, Condensed Matter
  • SILICON
  • Science & Technology
  • Technology

Digital Object Identifier (DOI)

publisher

  • ELSEVIER SCIENCE SA LAUSANNE

start page

  • 391

end page

  • 394

volume

  • 253

issue

  • 1-2