Inter-layer vias and TESH interconnection network for 3-D heterogeneous sensor system on a chip Conference

Bhansali, S, Chapman, G, Jain, V. (2005). Inter-layer vias and TESH interconnection network for 3-D heterogeneous sensor system on a chip . SMART BIOMEDICAL AND PHYSIOLOGICAL SENSOR TECHNOLOGY XI, 5796 306-317. 10.1117/12.606938

keywords

  • Engineering
  • Engineering, Multidisciplinary
  • Instruments & Instrumentation
  • Physical Sciences
  • Physics
  • Physics, Applied
  • SILICON
  • Science & Technology
  • Technology

Location

  • Orlando, FL

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • Conference on Unattended Ground Sensor Technologies and Applications VII

publisher

  • SPIE-INT SOC OPTICAL ENGINEERING

start page

  • 306

end page

  • 317

volume

  • 5796