Inter-plane via defect detection using the sensor plane in 3-D heterogeneous sensor systems Conference

Chapman, GH, Jain, V, Bhansali, S. (2005). Inter-plane via defect detection using the sensor plane in 3-D heterogeneous sensor systems . Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, 158-166. 10.1109/DFTVS.2005.42

cited authors

  • Chapman, GH; Jain, V; Bhansali, S

date/time interval

  • October 3, 2005 -

publication date

  • January 1, 2005

published in

keywords

  • 3D heterogeneous sensor
  • Computer Science
  • Computer Science, Hardware & Architecture
  • Engineering
  • Engineering, Electrical & Electronic
  • SOC
  • Science & Technology
  • Technology
  • fault detection
  • inter-plane vias
  • redundancy

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

start page

  • 158

end page

  • 166