Development of a through wafer 3D vertical micro-coaxial probe

Development of a through wafer 3D vertical micro-coaxial probe Article

Boone, Justin, Krishnan, Subramanian, Bhansali, Shekhar. (2013). Development of a through wafer 3D vertical micro-coaxial probe . JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 23(7), 10.1088/0960-1317/23/7/075029

cited authors

Boone, Justin; Krishnan, Subramanian; Bhansali, Shekhar

sustainable development goals

SDG 09: Industry, Innovation and Infrastructure

authors

Bhansali, Shekhar

publication date

July 1, 2013

webpage

https://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000321063300038&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=e451fd656366bf1ec5554941920a9ccb

published in

JOURNAL OF MICROMECHANICS AND MICROENGINEERING Journal

keywords

Engineering
Engineering, Electrical & Electronic
INTERCONNECTION
Instruments & Instrumentation
Nanoscience & Nanotechnology
Physical Sciences
Physics
Physics, Applied
Science & Technology
Science & Technology - Other Topics
Technology

FIU Discovery

Development of a through wafer 3D vertical micro-coaxial probe Article

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cited authors

sustainable development goals

authors

publication date

webpage

published in

Research

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Digital Object Identifier (DOI)

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