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Advancing Microelectronics
Journal
Overview
Identifiers
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Overview
publication venue for
High-Density Heterogeneous Integration for Implantable Electronic Systems
. 47:12-19.
2020
Electrodeposited copper-graphite composites for low-CTE integrated thermal structures
. 44:12-17.
2017
6G Hardware System Design and Packaging Needs
2023
Identifiers
International Standard Serial Number (ISSN)
2222-8748
