Journal of Electroceramics

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Journal of Electroceramics Journal

publication venue for

Leakage current analysis of hydrothermal BaTiO₃ thin films. 27:169-175. 2011
BaTiO₃ films by low-temperature hydrothermal techniques for next generation packaging applications
Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging

International Standard Serial Number (ISSN)

1385-3449

Electronic International Standard Serial Number (EISSN)

1573-8663