Digital Twin Emulation of a Hartley Oscillator Circuit for EMI and Thermal Mitigation of Semiconductor Device Packages
Conference
Sans, AJ, Perez-Pinon, A, Al-Duhni, GSG et al. (2025). Digital Twin Emulation of a Hartley Oscillator Circuit for EMI and Thermal Mitigation of Semiconductor Device Packages
. 3384. 10.23919/CNC-USNC-URSI64444.2025.11419960
Sans, AJ, Perez-Pinon, A, Al-Duhni, GSG et al. (2025). Digital Twin Emulation of a Hartley Oscillator Circuit for EMI and Thermal Mitigation of Semiconductor Device Packages
. 3384. 10.23919/CNC-USNC-URSI64444.2025.11419960
Higher manufacturing yields for higher density and higher data speed heterogeneous electronics imply Electromagnetic Interference (EMI) challenges. As an example, the realization of simple Hartley oscillator circuits require the packaging of passive components with an active device. Oscillatory circuits, like the Hartley oscillator, are well behaved at room temperature with acceptable margins. However, as the components are more densely packaged, there is Electromagnetic Interference (EMI) on the oscillator circuit, leading to a phase lock loop instability that must be addressed.
