A growing interest in AI and deep learning applications necessitates the development of efficient power delivery networks (PDNs) to manage broadband impedance in high-speed switching environments. This paper evaluates the electromagnetic performance of horizontal, vertical, and embedded PDNs in fan-out packages, with particular emphasis on vertical and embedded configurations, both less explored for noise mitigation. Simulations indicate that embedded PDNs significantly reduce common-mode (CM) and differential-mode (DM) radiation, achieving levels between 20-78 dBµV. Additionally, measurements show that embedded PDNs maintain a lower electric field strength of 1.9 V/m for DM radiation as compared to 2.7 V/m for horizontal PDNs and 11.4 V/m for vertical PDNs. Advanced shielding with 5-µm thick Cu-CoNiFe layers further reduces magnetic field emissions by 30-45 dB. These findings demonstrate that embedded PDNs are a more effective solution for electromagnetic interference (EMI) mitigation in future electronic systems, offering superior noise control and reduced crosstalk.