Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies Conference

Zurcher, P, Alluri, P, Chu, P et al. (2000). Integration of thin film MIM capacitors and resistors into copper metallization based RF-CMOS and Bi-CMOS technologies . 153-156. 10.1109/IEDM.2000.904281

cited authors

  • Zurcher, P; Alluri, P; Chu, P; Duvallet, A; Happ, C; Henderson, R; Mendonca, J; Kim, M; Petras, M; Raymond, M; Remmel, T; Roberts, D; Steimle, B; Stipanuk, J; Straub, S; Sparks, T; Tarabbia, M; Thibieroz, H; Miller, M

authors

date/time interval

  • December 10, 2000 -

publication date

  • January 1, 2000

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Materials Science
  • Materials Science, Multidisciplinary
  • Physical Sciences
  • Physics
  • Physics, Condensed Matter
  • Science & Technology
  • Technology

Location

  • CA, SAN FRANCISCO

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • IEEE International Electron Devices Meeting (IEDM)

publisher

  • IEEE

start page

  • 153

end page

  • 156