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Disassembling Software Instruction Types through Impedance Side-channel Analysis
Conference
Awal, Sadik, Rahman, Tauhidur. (2023). Disassembling Software Instruction Types through Impedance Side-channel Analysis .
2023 IEEE INTERNATIONAL SYMPOSIUM ON HARDWARE ORIENTED SECURITY AND TRUST, HOST,
227-237. 10.1109/HOST55118.2023.10133318
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Awal, Sadik, Rahman, Tauhidur. (2023). Disassembling Software Instruction Types through Impedance Side-channel Analysis .
2023 IEEE INTERNATIONAL SYMPOSIUM ON HARDWARE ORIENTED SECURITY AND TRUST, HOST,
227-237. 10.1109/HOST55118.2023.10133318
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Additional Document Info
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Overview
cited authors
Awal, Sadik; Rahman, Tauhidur
authors
Rahman, Tauhidur
date/time interval
May 1, 2023 -
publication date
January 1, 2023
published in
2023 IEEE INTERNATIONAL SYMPOSIUM ON HARDWARE ORIENTED SECURITY AND TRUST, HOST
Journal
Research
keywords
ATTACKS
Computer Science
Computer Science, Hardware & Architecture
Computer Science, Information Systems
HARDWARE PERFORMANCE COUNTERS
Science & Technology
Side-channel
Technology
hardware security
impedance
instruction disassembling
switching activity
Identifiers
Digital Object Identifier (DOI)
https://doi.org/10.1109/host55118.2023.10133318
Additional Document Info
start page
227
end page
237