FUNDAMENTAL INTERCONNECTION ISSUES. Article

Hatamian, M, Hornak, LA, Little, TE et al. (1987). FUNDAMENTAL INTERCONNECTION ISSUES. . AT&T Technical Journal, 66(4), 13-30. 10.1002/j.1538-7305.1987.tb00215.x

cited authors

  • Hatamian, M; Hornak, LA; Little, TE; Tewksbury, SK; Franzon, P

abstract

  • This paper presents several current interconnection issues as well as future technological directions for improved interconnection/communication performance. The physical hierarchy o interconnections and the corresponding communication environment are highlighted. General issues concerning chip-to-chip and on-chip interconnections are reviewed, with particular emphasis on chip or wafer-level clock distribution. Finally, wafer-scale related system modules and optical interconnections are discussed from a 'macro-integration' perspective.

authors

publication date

  • January 1, 1987

published in

Digital Object Identifier (DOI)

start page

  • 13

end page

  • 30

volume

  • 66

issue

  • 4