Thermal Aware System-Wide Reliability Optimization for Automotive Distributed Computing Applications Article

Bankar, Ajinkya S, Sha, Shi, Bhimani, Janki et al. (2022). Thermal Aware System-Wide Reliability Optimization for Automotive Distributed Computing Applications . IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, 71(10), 10442-10457. 10.1109/TVT.2022.3185978

International Collaboration

cited authors

  • Bankar, Ajinkya S; Sha, Shi; Bhimani, Janki; Chaturvedi, Vivek; Quan, Gang

sustainable development goals

authors

publication date

  • October 1, 2022

published in

keywords

  • Automotive Reliability
  • Computational modeling
  • ECU
  • ENERGY
  • Engineering
  • Engineering, Electrical & Electronic
  • FEASIBILITY ANALYSIS
  • ISO 26262
  • MANAGEMENT
  • Optimization
  • REAL-TIME SYSTEMS
  • Reliability
  • Runtime
  • Science & Technology
  • System-Level MTTF
  • TECHNOLOGY
  • Task analysis
  • Technology
  • Telecommunications
  • Temperature sensors
  • Thermal Aware
  • Transient analysis
  • Transportation
  • Transportation Science & Technology
  • VERIFICATION

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 10442

end page

  • 10457

volume

  • 71

issue

  • 10