Nanoscale Vertical Interconnects for 3D MEMS Packaging Article

Aravamudhan, Shyam, Kedia, Sunny, Bhansali, S. (2006). Nanoscale Vertical Interconnects for 3D MEMS Packaging . MA2005-01(1), 60-60. 10.1149/ma2005-01/1/60

cited authors

  • Aravamudhan, Shyam; Kedia, Sunny; Bhansali, S

authors

publication date

  • February 22, 2006

Digital Object Identifier (DOI)

publisher

  • The Electrochemical Society

start page

  • 60

end page

  • 60

volume

  • MA2005-01

issue

  • 1