Modular design for epidermal temperature sensing Conference

Pozdin, VA, Dieffenderfer, J, Williams, E et al. (2017). Modular design for epidermal temperature sensing . 2017-December 1-3. 10.1109/ICSENS.2017.8233976

cited authors

  • Pozdin, VA; Dieffenderfer, J; Williams, E; Sotory, P; Yokus, MA; Bozkurt, A; Daniele, MA

abstract

  • As wearable biosensor systems are integrating multiplexing capabilities, the size of control electronics is increasing. A modular design approach separating the control electronics from the sensing components is advantageous to produce low cost and wearable solutions. By making the sensing components on disposable low-cost patches, the control electronics can be made with custom signal processing chips and reused to reduce the cost per test. Towards achieving this goal, we demonstrate the integration of flexible and conformal substrates with wireless temperature sensing electronics.

publication date

  • December 21, 2017

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

start page

  • 1

end page

  • 3

volume

  • 2017-December