Thermal and mechanical design of tangential hybrid microchannel and high-conductivity inserts for cooling of disk-shaped electronic components Article

Dadsetani, R, Sheikhzade, GA, Goodarzi, Marjan et al. (2021). Thermal and mechanical design of tangential hybrid microchannel and high-conductivity inserts for cooling of disk-shaped electronic components . JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, 143(3), 2125-2133. 10.1007/s10973-020-10232-w

International Collaboration

cited authors

  • Dadsetani, R; Sheikhzade, GA; Goodarzi, Marjan; Zeeshan, Ahmad; Ellahi, Rahmat; Safaei, Mohammad Reza

authors

publication date

  • February 1, 2021

published in

keywords

  • Chemistry
  • Chemistry, Analytical
  • Chemistry, Physical
  • Cooling
  • HEAT-TRANSFER ENHANCEMENT
  • High-conductivity
  • Hybrid method
  • Microchannel
  • NANOFLUID FLOW
  • Physical Sciences
  • Science & Technology
  • Strength
  • Thermal stresses
  • Thermodynamics
  • VASCULARIZATION

Digital Object Identifier (DOI)

publisher

  • SPRINGER

start page

  • 2125

end page

  • 2133

volume

  • 143

issue

  • 3