Conformal Welding for Brain-Intelligence Analysis Conference

Yang, Liqun, Razib, Muhammad, He, Kenia Chang et al. (2020). Conformal Welding for Brain-Intelligence Analysis . EURO-PAR 2011 PARALLEL PROCESSING, PT 1, 11844 368-380. 10.1007/978-3-030-33720-9_28

International Collaboration

cited authors

  • Yang, Liqun; Razib, Muhammad; He, Kenia Chang; Yang, Tianren; Lu, Zhong-Lin; Gu, Xianfeng; Zeng, Wei

sustainable development goals

authors

date/time interval

  • October 7, 2019 -

publication date

  • January 1, 2020

published in

keywords

  • Brain structure
  • CORTICAL SURFACE
  • Computer Science
  • Computer Science, Artificial Intelligence
  • Computer Science, Software Engineering
  • Conformal welding
  • Human intelligence
  • Science & Technology
  • THICKNESS
  • Technology

Location

  • NV

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

Conference

  • 14th International Symposium on Visual Computing (ISVC)

publisher

  • SPRINGER INTERNATIONAL PUBLISHING AG

start page

  • 368

end page

  • 380

volume

  • 11844