Packaging, Interconnects, MCMs, Hybrids, and Passive Circuit Elements-Polymer-Ceramic Composites for Microwave Applications: Fabrication and Performance Assessment Other Scholarly Work

Koulouridis, S, Kiziltas, G, Zhou, Y et al. (2006). Packaging, Interconnects, MCMs, Hybrids, and Passive Circuit Elements-Polymer-Ceramic Composites for Microwave Applications: Fabrication and Performance Assessment . 54 4202-4208.

cited authors

  • Koulouridis, S; Kiziltas, G; Zhou, Y; Hansford, DJ; Volakis, JL

authors

publication date

  • January 1, 2006

publisher

  • New York, NY: Professional Technical Group on Microwave Theory and …

start page

  • 4202

end page

  • 4208

volume

  • 54