Packaging, Interconnects, MCMs, Hybrids, and Passive Circuit Elements-Polymer-Ceramic Composites for Microwave Applications: Fabrication and Performance Assessment
Other Scholarly Work
Koulouridis, S, Kiziltas, G, Zhou, Y et al. (2006). Packaging, Interconnects, MCMs, Hybrids, and Passive Circuit Elements-Polymer-Ceramic Composites for Microwave Applications: Fabrication and Performance Assessment
. 54 4202-4208.