This paper presents the effects of the size and location of the contact dimples on the heating of RF MEMS cantilever contact switches. The analyses are based on electromagnetic model with the extended finite element-boundary integral (EFE-BI) method, integrated with thermal model with the finite element (FE) method. Simulation results demonstrate that larger dimples result in lower contact temperature, suggesting the higher power delivery capability of the dimples with a large contact area.
