A liquid cooler module with carbon foam for electronics cooling applications Article

Cao, Yiding, Ponnappan, Rengasamy. (2008). A liquid cooler module with carbon foam for electronics cooling applications . Journal of Enhanced Heat Transfer, 15(4), 313-324. 10.1615/JEnhHeatTransf.v15.i4.40

keywords

  • Engineering
  • Engineering, Mechanical
  • HEAT
  • MEDIA
  • Physical Sciences
  • Science & Technology
  • Technology
  • Thermodynamics
  • and electronics cooling applications
  • carbon foam
  • liquid cooler module

Digital Object Identifier (DOI)

start page

  • 313

end page

  • 324

volume

  • 15

issue

  • 4