Selective seeding of copper films on polyimide-patterned silicon substrate, using ion implantation Article

Bhansali, S, Sood, DK. (1996). Selective seeding of copper films on polyimide-patterned silicon substrate, using ion implantation . Sensors and Actuators, A: Physical, 52(1-3), 126-131. 10.1016/0924-4247(96)80137-3

keywords

  • ELECTROLESS
  • Engineering
  • Engineering, Electrical & Electronic
  • Instruments & Instrumentation
  • Science & Technology
  • Technology
  • electroless Cu plating
  • implantation
  • polyimide
  • silicone

Digital Object Identifier (DOI)

start page

  • 126

end page

  • 131

volume

  • 52

issue

  • 1-3